Solder heat resistance test for surface mount components
Moisture accumulated inside the component vaporizes due to thermal stress! Stress occurs due to volume expansion.
In the "Solder Heat Resistance Test for Surface Mount Components," we simulate the process from moisture-proof packaging of surface mount components to reflow, evaluating their thermal stress resistance. In cases of defects that occur during the test, moisture accumulated inside the components vaporizes due to thermal stress, causing volume expansion and resulting in stress. This stress can lead to delamination and cracks at the interface. Since these anomalies are difficult to detect visually, we use an ultrasonic microscope to inspect the internal adhesion state. [Test Flow] ■ Confirm initial state ■ Dehumidify in a constant temperature chamber ■ Humidify in a constant temperature and humidity chamber ■ Apply thermal stress using a reflow device ■ Confirm post-test state *For more details, please download the PDF or feel free to contact us.
- Company：東芝ナノアナリシス
- Price：Other
